1. Input control of materials

To scan all incoming materials, laboratory control sample, if necessary, the entire control of the material.

2. Cut into work pieces for a given route

Standard work piece is a 500h550 mm one, but for small batches smaller piece are used to reduce process wastes. Pruning (cutting) is carried out by guillotine or by blanking dies, diamond disc …

3. Boring

On the boards of a complex figure (bit less than 0.6 mm) to improve the quality of drilling between the workpieces PCB aluminum foil (or paper-based laminate) is laid. Paper-based laminate of 2-3 mm thickness is used to exit the drill bit .

For rapid changes in tape drill there is a possibility of manual adjustment of drilling programs directly from the remote machine at modern models.

4. 1 st hole metallization

Chemical and galvanic process (a Shipley process) followed by buildup of electroplated to 4 microns. Provides initial plating in all the holes (if the metallization is not needed in some sort of hole, it is plugged by a special tube).

5. Surface preparation before applying the photoresist

A mechanical or water jet (blast) cleaning of the surface is used for fiberglass with a copper foil thickness for more than 18 m, less than 18 microns (the material commonly used for the manufacture of PCB with tracks less than 15 microns) – microundercut.

6. Lamination

Lamination is the process of applying photoresist film to the printed circuit board.

7. Exposure

Workpiece coated with a protective photoresist illuminates through a photomask pattern with the taking over of the image on the photoresist.

8. Manifestation

Stage with a visual control of the correct drawing of PCB and retouched by the photoresist.

9. 2-nd metallization

Galvanic capacity of plastic copper at the via-holes and conductors up to 25 – 30 mm.

10. Removal of photoresist

The chemical process in an alkaline environment in a modular line. At the end – a visual control.

11. Protective coating resist

12. Etching

Etching of copper surface not covered by a protective layer of electroplating copper.

13. Removing the technological layer of protective photoresist

14. Scraping the surface before applying the mask

15. Application of the liquid mask

Can be applied as a photosensitive and 2-component Mask (by screen printing).

16. Drying Mask

Infrared drying with active ventilation to ensure the uniformity of the coating.

17. Exposure

18. Film development

19. Cure

Can be used as ultraviolet curing and thermostabilisation (provided by more stringent conditions).

20. Surface preparation for application of solder

Protecting planar outputs for covering with nikilem, palladium, gold.

21. Melting of the coating tin-lead (CTL)

Melting occurs in the plated holes, and on the plane. Alignment of the solder by hot air. Applied to CTL-61 with thickness of 8-18 mm.

22. Marking

23. Coverage of the lamellae and planar sites Au, Ni, Pl, C

24. Cut into single printed circuit board

Applied diamond blade, scribing, the guillotine.

25. Output control

The control can be visual, electrical depending on the type of fees and terms of reference. Electrical test control provides the examination of the PCB for an open or short circuit.

26. Printing of technical documentation and packaging

Resinite – manufacturing of printed circuit boards of domestic and imported materials. Prototyping. High-tech equipment for rapid production of printed circuit board layout, the SMD-assembly of printed circuit boards for testing on printed circuit boards, fabrication of photomasks. Services for printed circuit board trace, transfer for SMD technology. Assembly of printed circuit boards (including low-volume).

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